Dear Reader,
As you know, the semiconductor industry was affected by a number of natural disasters in the past year, and our thoughts and sympathies remain with those still suffering. While these events have been extremely difficult, the rapid recovery of manufacturing operations in the impacted regions gives clear testimony to the resiliency and strong collaborative nature of our industry.

This spirit of collaboration, as well as excitement about the many opportunities for growth and innovation in semiconductor manufacturing, was apparent at the 2012 LithoVision technical symposium held prior to SPIE Advanced Lithography. More than 500 international representatives from across our industry attended the 9th annual event where industry experts from Nikon, QUALCOMM, Intel, NIST, Dai Nippon Printing, and CEA-Leti delivered insightful presentations discussing key lithography issues and solutions. The day’s agenda was highlighted by presentations on the Industry Roadmap and Future Device Trends, Enabling Production Beyond 22 nm, Extending Lithography with Alternative Solutions, and more, while the evening poster session/reception featured informative posters contributed by a dozen partner companies. Highlights of a number of the LithoVision presentations are featured in this edition of the Nikon eReview, and full event materials are available to customers upon request.

In other news, Nikon has begun shipping the NSR-S621D immersion and NSR-S320F dry ArF scanners—the latest evolutions of the proven Streamlign platform, to satisfy customers’ rigorous requirements for cost-effective 22 nm applications and beyond. In light of EUV infrastructure delays and the heightened demand for ArF extension solutions, Nikon has constructed an additional manufacturing facility in Kumagaya, Japan to boost ArF scanner production capacity. Nikon values your input on how we can continue to improve our products, programs, and services, and we invite you to respond to the Nikon eReview (npicom@nikon.com) with your comments or suggestions.

News

QUALCOMM and Nikon Executives Report on the Industry Roadmap and Future Device Trends

QUALCOMM and Nikon Executives Report on the Industry Roadmap and Future Device Trends

At the 2012 LithoVision symposium earlier this year, Nikon General Manager Masato Hamatani reported on the challenges associated with IC making and scanner technology, and provided the audience with Nikon’s roadmap and solutions. In a complementary presentation, Dr. Geoffrey Yeap, QUALCOMM Vice President, provided insight to the requirements and future device trends from the fabless perspective.


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Intel and Nikon Lithography Experts Update on Enabling Production Beyond 22 nm

Litho Directors from Intel and Nikon Update on Enabling 32 nm Production and Beyond

Sam Sivakumar, Intel Corporation Fellow and Director of Lithography, reported at LithoVision that edge placement error control and multi-layer overlay will be crucial for achieving scaling goals, and that technical evolution of both immersion and dry scanners is essential. Nikon experts then discussed how advancements in scanner accuracy, productivity, and extendibility are enabling production beyond 22 nm.


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Technologists from DNP and Nikon Discuss Computational Lithography Solutions

Technologists from DNP and Nikon Discuss Computational Lithography Solutions

Speaking recently at the LithoVision technical symposium, Naoya Hayashi, Dai Nippon Printing Company Fellow, explained that ArF lithography will be extended with computational litho technologies. He also highlighted various requirements and challenges associated with mask making. Tomoyuki Matsuyama, Nikon Strategic Imaging Solutions Section Manager, then delivered a presentation describing scanner challenges and Nikon solutions that enable computational lithography.


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The Future of 450 mm and EUV Highlighted at LithoVision

NLithoVision Presentations Highlight EUV HVM Challenges and Nikon Advancements

Nikon General Manager Masato Hamatani highlighted the importance of the 450 mm transition and criticality of its timing, and discussed EUV readiness during the Nikon symposium held earlier this year. Katsuhiko Murakami, Nikon EUVL Team Leader, then provided details of the EUVL HVM challenges and reported on achievements with high-NA projection optics designs, coating improvements, and contamination control.


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Featured Article

NIST, CEA-Leti, and Nikon Leaders Address Extending Lithography with DSA

Advanced Binary Film for 193 nm Lithography Extension to Sub-32 nm Node

Technology leaders from across the industry provided insight on extending lithography using alternative solutions at the annual Nikon symposium. Dr. Gregg Gallatin of NIST discussed use of directed self-assembly (DSA) of block copolymers, which was complemented by presentations from Doctors Serge Tedesco and Raluca Tiron of CEA-Leti. In addition, Dr. Soichi Owa of Nikon reported on potential DSA applications. 


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Innovations and Enhancements

Enabling ArF Extension with Overlay Enhancement Solutions

Enabling ArF Extension with Overlay Enhancement Solutions

At SPIE Advanced Lithography, Yuji Shiba, Nikon System Designer, reported that as device densities increase with double patterning, enhanced overlay performance will be crucial to ArF extension. He explained that the NSR-S621D is the latest evolution of the proven Streamlign platform and reported on a number of innovations that heighten scanner alignment capabilities and enable industry-leading overlay accuracy and stability in manufacturing.


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Nikon Happenings

Nikon Constructs New Manufacturing Facility to Meet ArF Demand

Extension of ArF lithography is vital in keeping IC makers on their aggressive technology roadmaps, and immersion systems will dominate the litho equipment market for the next several years. To satisfy customer demand, Nikon constructed an additional manufacturing facility in Kumagaya, Japan to boost production capacity for dry and immersion ArF scanners.


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Analog Devices Names Nikon Precision 2011 Supplier Excellence Award Recipient

Nikon Precision recently received the prestigious Supplier Excellence Award from Analog Devices Inc. (ADI) for our support in 2011. This award recognizes outstanding suppliers that play a key role in ADI’s success and work with ADI on further development and improvement of products and manufacturing processes.


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LithoVision 2012 Breaks Attendance Records

Although 2011 was marked with a number of unpredictable challenges for our industry, the semiconductor manufacturing community adapted efficiently and recovery is well underway. At LithoVision earlier this year Nikon was pleased to host a record number of customers and industry partners seeking insight into future lithography trends, challenges, and innovations.


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Nikon Teams with Industry Partners to Support SEMI High Tech University

Nikon places great value on the opportunity to give back to our industry by providing support for next generation engineers and leaders through involvement with SEMI High Tech University. Last fall, Nikon worked with a number of industry partners to bring this three-day program, administered and presented by the non-profit SEMI Foundation, to 36 California high school students.


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