| Nikon Corporation Announces Convertible
Bond Offering
Intel to Invest Y10B in Nikon's Advanced Optical Lithography
Program
Tokyo, Japan - May 28,
2002 --
Nikon announced today that the company is issuing a
new group of securities in the form of convertible
bonds. Intel has agreed to purchase a concurrent offering
of these bonds in the amount of Y10B (approximately
US$80 M). Assuming conversion of these bonds, Intel
would receive shares representing approximately 1.36%*
of Nikon's current outstanding shares. Nikon and Intel
have enjoyed a commercial relationship for many years
and are now entering into an agreement specifically
intended to result in Advanced Optical Lithography
or Next Generation Lithography (NGL) tools that will
allow production of semiconductor devices with features
of 90 nm, 65 nm and below.
Mr. Shoichiro Yoshida, Chairman and CEO of Nikon Corporation,
commented that "Working with Intel, the world's largest semiconductor
company, provides Nikon unique insight to the requirements of
future lithography tools. This investment will provide support
for our program as well serve to further strengthen our long
relationship. We are confident that we can meet Intel's expectations
and develop advanced lithography tools that will contribute to
the progress of the semiconductor industry."
"Continued research and development in the field of lithography
is critical to the long-term growth of our industry," said Jai
Hakhu, vice president Technology Manufacturing Group and general
manager Technology Manufacturing Engineering. "Intel makes investments
like this one which insure continued availability of the lithography
tools required by the industry to track to Moore's law."
Nikon is currently working on several NGL technologies to meet
the various needs of its customers and maintain the ITRS Roadmap.
These include 157 nm using F2 (calcium fluoride) and 13.5 nm
EUVL (Extreme UV Lithography). Both F2 and EUVL present significant
challenges to both equipment makers as well as semiconductor
makers. Nikon's 1st F2 tools are scheduled for delivery in 2004.
The semiconductor industry's continuous need for equipment like
this is driven by the requirement to make ever smaller and faster
devices that are less costly and require less power than each
previous generation.
* The expected percentage after conversion of the whole bonds
including separate public offering of 40 billion yen
About Nikon: Nikon is a leading developer and manufacturer of
advanced optical and precision equipment. Nikon designs and makes
precision equipment for use in semiconductor and liquid crystal
display ("LCD") fabrication, inspection and measurement. Nikon
also makes visual imaging products including cameras, instruments
such as microscopes and other products such as binoculars and
surveying instruments. With its strong and long-standing customer
relationships, global brand recognition and technical expertise,
Nikon maintains its leadership position through its emphasis
on cutting-edge research and development and its ability to adapt
its products to meet its customers' quickly changing needs.
These materials are not an offer for sale of the Bonds in the
United States. The Bonds have not been registered under the U.S.
Securities Act of 1933, as amended (the "Securities Act"), and
may not be sold in the United States absent registration or an
exemption from registration under the Securities Act.
###
U.S. Contacts:
Frank Masciocchi
Vice President Sales and Marketing
Nikon Precision Inc.
650 508 4618
frankm@nikon.com
Susan Bernardi
Nikon Precision Inc.
(650) 508-3819
sbernardi@nikon.com
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