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| Upcoming
Events |
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SEMICON West
2008
July 15-17, 2008
Moscone Center
San Francisco, California
Visit Nikon in Booth 5947 |
|
SEMICON West
Nikon Technology Luncheons
July 15 & 16, 2008
REGISTER NOW |
|
SEMICON
West
Hospitality Event
Hosted by Nikon and Synopsys
July 16, 2008 |
|
5th International
Symposium on Immersion Lithography
September 22-25, 2008
The Hague, Netherlands |
|
2008 International
Symposium on Extreme Ultraviolet Lithography September
28 - October 1, 2008
Lake Tahoe, California |
|
SEMICON
Europa 2008
October 7-9, 2008
Stuttgart, Germany |
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Dear Reader,
At Nikon, our primary objective is to deliver the lithography solutions
and services that enable you to stay ahead of your competitors—in
whichever market you compete. As you read through this premiere
edition of the Nikon eReview, you will find topics ranging from
our new Skyhook lens design for i-line steppers to immersion
and EUV technology. We’ll also discuss future lithography trends,
and provide technical content from Toshiba, Selete, and IBM.
We sincerely hope you find the Nikon eReview informative, and
encourage you to respond to the Nikon eReview (npicom@nikon.com)
with comments and suggestions on how we can better serve our
customers. |
 
| Skyhook
Technology Eliminates Vibration and Optimizes Stepper
Stability |
 |
NSR-SF150 and SF155 i-line
steppers use leading-edge Nikon Skyhook Technology, where
the lens module is suspended from the stepper main body
to eliminate the influence of ground and stage vibration
on the lens and associated metrology, while optimized airflow
and temperature control enhance system performance and
stability. |
 Read
More |
Toshiba
Using NSR-S610C Immersion Scanners for
45nm Manufacturing |
|
Reporting on the current status
of immersion for NAND and CMOS devices at LithoVision 2008,
Soichi Inoue, Group Manager of Toshiba Corporation Lithography
Process Development, announced that immersion lithography
was sufficiently mature for the 45 nm half pitch, with Toshiba
already producing 43 nm HP NAND flash devices using the NSR-S610C. |
| Read
More |
| Selete Achieves Resolution of 30nm Features Using Nikon EUV1 System |
|
While the industry is currently
focused on immersion and 45 nm technology, Nikon is aggressively
developing full-field EUV exposure tools for sub 32 nm
applications. At the SPIE Advanced Lithography conference
earlier this year, Ichiro Mori, Selete Director and General
Manager of Lithography Research shared data from the Nikon
EUV1 system demonstrating successful resolution of 30 nm
L/S and 30 nm contact holes. |
| Read
More |
| IBM
Expert Discusses Lithography System Trends |
|
Tim Farrell, Distinguished Engineer
from the IBM Systems and Technology Group, presented his view
on future lithography system trends at the 2008 LithoVision symposium
earlier this year. For continued density scaling through 32 nm
half pitch, there is a need for increased integration across
tools, materials, mask fabrication, fab control systems, and
computational processing. Additionally, co-optimization of circuit
design with process technology will be required. |
| View
Presentation |
|
