26 µm depth of focus accommodates extreme process requirements
The NES2-h06 Mini Stepper utilizes a 0.11 numerical aperture projection lens with 1.8x reduction that was specifically designed to address the unique process challenges presented by MEMS and LED applications. The h06 lens design enables a depth of focus up to 26 µm with resolution down to 3.0 µm, while its advanced autofocus system provides die-by-die autofocus capabilities that further increase yield for these difficult processes.
Delivers maximum productivity with 60 WPH throughput (200 mm)
The NES2-h06 supports wafer sizes up to 200 mm and can process 60 wafers per hour (44 exposure shots at 22 mm step pitch). In addition, this Mini Stepper minimizes total fab costs with the control system and thermal chamber actually built into the main body to enable a remarkably small footprint of only 3.3 m² – including the wafer loader unit.
22 mm field size enhances mix and match with NSR steppers
The NES2-h06 makes use of advanced lens technology to enable the same 22 mm x 22 mm exposure field as traditional 5x reduction steppers, simplifying mix-and-match applications while boosting productivity. To further simply matching and reticle design, it is also possible to use the same alignment marks (FIA X/Y simultaneous marks) on the NES2 systems as on traditional NSR steppers.
Provides 0.35 µm overlay performance for large field
The NES2-h06 employs enhanced global alignment (EGA) to optimize overlay accuracy to 0.35 µm for the large 22 mm field. EGA functions by utilizing multiple alignment marks across the wafer to ensure best fit alignment and thereby compensate for rotation issues or process-induced deformations. Pattern Matching Alignment capabilities are also available to provide increased flexibility for reticle design.
Customers may also choose to add on backside alignment functionality to enable precise alignment of 0.8 µm and below to marks located on the backside of the wafer surface for bulk MEMS-type applications, etc.
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NES2-h06
