Delivers world-class dry ArF performance and productivity with the proven Streamlign platform
The semiconductor industry is transitioning to development and high volume manufacturing of next generation process devices, with the most critical layers exposed using ArF immersion scanners with multiple patterning. In addition, as design rules for new technologies become more challenging, many layers will need to transition from KrF to ArF dry processes. This necessitates dry 193 nm scanners that deliver ultra-high productivity with overlay accuracy comparable to immersion systems, as well as exceptional system stability and matching capabilities.
Overlay accuracy ≤ 3 nm and advanced overlay solutions enable superior yield
Interferometers alone cannot sufficiently measure stage position repeatability to satisfy the most stringent dry ArF overlay requirements. Therefore, the NSR-S320F utilizes the proven Bird’s Eye Control system, which uses laser encoders along with conventional interferometers to accurately determine wafer position time after time. These innovations enable superior focus control, and overlay accuracy ≤ 3 nm. With overlay improved by more than 50% compared to the previous generation system, the S320F delivers maximized yield for leading-edge dry ArF applications.
For heightened matching accuracy, compensation functions that adjust the grid and distortion of one scanner to another are also imperative.The S320F supports advanced shot distortion correction capabilities provided by Dynamic Matching Adjustment Control, with k18 c-shape distortion compensation newly added to enable distortion correction along the scan slit. Actual mix-and-match overlay performance using the NSR-S621D immersion scanner for the first print and the S320F for the second print showed mix-and-match overlay stability across 3 days below 4.5 nm (Avg. + 3σ).
Ensures optimal affordability with throughput ≥ 200 wafers per hour
IC makers will utilize dry lithography as much as possible to balance multiple patterning costs. Therefore, S320F throughput is a critical factor in making advanced processes cost effective for manufacturing. The NSR-S320F employs improved dry sequencing, and its wafer stage uses optimized scan speed and acceleration capabilities to reduce exposure time. In addition, the Stream Alignment wafer mapping system utilizes multiple alignment microscopes (Five-Eye FIA) and a wide area autofocus sensor (Straight Line Autofocus) that spans the wafer to pre-scan the substrate during loading−dramatically reducing wafer overhead time. Together, these innovations enable world-class throughput ≥ 200 wafers per hour (WPH). The S320F has already processed > 210.9 WPH (125 exposures/wafer), and demonstrated 96 exposure shot performance of 233 WPH—which is 60% higher than the previous generation NSR-S310F capabilities.
Established 0.92 NA lens provides excellent imaging
The S320F features the mature Nikon 0.92 numerical aperture projection lens to deliver resolution of 65 nm or better, with optimal CD uniformity. Superior materials and proprietary manufacturing technology provide a virtually perfect lens that is essentially flare free and has the industry’s lowest aberration levels. The S320F employs the iMAC lens controller to provide sophisticated lens tuning capability, coupled with POLANO polarization control, which enhances image contrast without any loss of illumination power or throughput. In addition, the optional Reticle Bending function enables correction for lens field curvature and/or curvature differences between reticles, to further enhance imaging performance.
Modular design streamlines installation and repairs
Being first to market with new devices can be the difference between profit and loss. To help customers meet this challenge, the S320F incorporates the mature Modular² Structure also used on the NSR-S620D/S621D to streamline system installation and minimize time to production. The Modular² Structure uses standalone subassemblies to improve system setup, and simplify assembly and maintenance.