Uses proven technology
to extend dry ArF beyond 65 nm
The NSR-S310F combines technology advancements from leading-edge
dry and immersion systems to provide a high productivity dry
ArF scanner for critical applications. The
S310F features the proven Nikon 0.92 numerical aperture projection lens and an
increased maximum sigma to deliver resolution of 65 nm or better, with optimal
CD uniformity.
Tandem Stage delivers ≥ 174
WPH and optimal stability
The S310F adopts the same platform as the NSR-S610C immersion
scanner, using the Tandem Stage to provide superior performance
with excellent cost of ownership. This high productivity platform
enables the NSR-S310F to deliver throughput ≥ 174 wafers per
hour.
Enhanced resolution and depth of focus using fourth
generation POLANO
The S310F uses mature Nikon POLANO polarization technology to control
the polarization direction without a loss of power and maintain
the degree of polarization in the illumination homogenizer. POLANO
enhances image contrast and reduces mask error factor (MEF) without
any loss of illumination power or throughput.
Superior overlay accuracy (≤ 7
nm)
The Tandem Stage design uses only one stage for exposure, with
the other used for calibrations during wafer exchange. This eliminates
stage mismatching error and enables frequent calibrations to
enhance overlay performance and scanner stability over time. The
S310F delivers overlay accuracy ≤ 7 nm.
Excellent cost of ownership
NSR-S310F throughput was improved by 20% over the previous generation system.
This is made possible by increased wafer stage speed (600 mm/sec), a faster
reticle stage, and reduced alignment time. Together with excellent uptime,
ease of maintenance, and the extensive use of auto-calibration functions, the
S310F delivers lower cost of ownership compared to ArF scanners from other
manufacturers.
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NSR-S310F
