Hyper-NA scanner for 55 nm production and 45 nm development
The NSR-S609B was the world’s first lithography system with
a hyper-NA lens. With a 1.07 projection lens numerical aperture,
this ArF immersion scanner was designed for mass production of
55 nm and development of 45 nm devices. The S609B began shipping
early in 2006.
Superior imaging
The S609B uses all-refractive projection optics enabling Nikon
to take advantage of a long history of refractive optics expertise.
The S609B lens design delivers imaging below 55 nm with a dramatically
expanded depth of focus, and POLANO polarization control enables
50 nm half-pitch capabilities without any loss of illumination
power or throughput.
No immersion-specific defects
Innovative Nikon Local Fill Technology combines our proprietary nozzle design, high water flow rate, and surface tension for water containment, enabling performance free of tool-induced immersion-specific defects. Nikon Local Fill Technology is compatible with a wide
variety of ArF resists and topcoats, enabling defect levels
on par with today’s most advanced dry ArF systems at
the maximum throughput.
Designed for high volume manufacturing
The S609B Tandem Stage was designed for high volume manufacturing,
providing optimized performance and efficiency for immersion
lithography. The exposure stage processes wafers at very high
rates, while the calibration stage is used for calibrations during
wafer exchange. The Tandem Stage enables throughput ≥ 130
wafers per hour, and delivers wet-dry overlay matching equivalent
to dry system performance.
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NSR-S610C
