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  • Ultra-high throughput (180 WPH)
  • Ideal for mix-and-match applications
  • Superior lens stability
  • Excellent overlay accuracy of ≤ 25 nm
  • Low cost of ownership
  • Extendible platform

Wavelength (nm) 365
Lens-NA 0.62
Exposure Area (mm) 26 x 33
Reduction Ratio 1/4
Resolution (nm) ≤ 280
Throughput:  
300 mm, 76 exp fields ≥ 180
Wafer Size 300
Ultra-high throughput
The NSR-SF150 is the sixth generation SF system. The groundbreaking SF150 design increases throughput by more than 50% over the previous generation stepper. The new wafer exchange system with optimized load and unload positioning reduces wafer exchange time by 60%, while the lightweight, high-acceleration wafer stage shortens stepping time by nearly a third. In addition, alignment times are halved using enhanced alignment processing speed. These design innovations enable the SF150 to deliver more than 180 wafers (300 mm) per hour.

Ideal for mix-and-match applications
The new Nikon SF150 system makes use of leading-edge lens manufacturing technology to enable the same wide exposure field as KrF and ArF scanners (26 x 33 mm), simplifying mix-and-match applications while improving productivity.

Optimum stability with new lens technology
Nikon Skyhook Technology suspends the SF150 lens module from the main body. This eliminates any influence of ground or stage vibration on the lens or associated metrology. The lens positioning is intelligently controlled using non-contact actuators. In addition to reducing vibration, Skyhook Technology provides ample space to optimize airflow and temperature control, which improves lens stability. Comprehensive environmental controls ensure lens quality is maintained over the lifetime of the tool, providing excellent long term imaging performance.

Excellent overlay accuracy
SF150 overlay accuracy is tightened by nearly 30% over the previous generation system through lens and stage improvements. Lens enhancements include Skyhook Technology, which reduces vibration to ensure lens stability. In addition, the new SF150 stage design provides enhanced positioning control and six degrees of freedom for wafer stage control to further enhance overlay performance. The SF150 also incorporates the advanced FIA alignment system that is used on leading-edge Nikon scanners. The SF150 delivers overlay accuracy of ≤ 25 nm, exceeding the requirements for today’s sub-critical layers.

Low cost of ownership for i-line applications
The SF150 delivers a 25% reduction in cost of ownership compared to the previous generation SF140. This stepper delivers over 180 wafers per hour on a cost-effective platform. The SF150 successfully combines a cutting-edge stage design and Skyhook Technology to deliver superior performance and low cost of ownership for i-line applications.

Extendible platform
Nikon understands that customers require continuous improvements to productivity and on-going enhancements to system performance. Therefore, the SF150 was intelligently designed to be field upgradeable and Nikon offers chargeable upgrades to further increase existing system’s throughput to match SF155 capabilities. The SF150 will not only meet today’s manufacturing requirements, but future cost-effective field upgrades will make these systems useful for several product generations to come.

The SF150 easily satisfies overlay requirements for sub-critical layers, with performance well below the ≤ 25 nm specification.





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