Many fabs already rely on the flexibility and timeliness
of our laboratory to accomplish time-driven, critical wafer processing.
Nikon offers 200 mm bare silicon ultra-flat wafers with overall wafer
flatness specifications at ≤ 1.0 µm, with a local field
flatness (22 mm X 22 mm) ≤ 0.12 µm. We can
also provide KrF resist coated wafers. Ultra-flat Nikon wafers minimize
the wafer flatness contribution to critical imaging results, yielding
consistent data that enables reduced lens adjustment and qualification
time.
The NPI laboratory also provides wafer processing services for customer
designed projects. We offer our state-of-the-art KrF (248 nm) DUV scanner
lithography systems with 4X reduction, in addition to TEL ACT8 and ACT12
DUV coater/developers to produce high resolution wide-field (25 mm X
33 mm) exposures for our customers. Utilization of these services eliminates
the impact of characterization work on your fab's limited manufacturing
resources. |
