Lithography requirements continue to accelerate. With a proven history of innovation, Nikon is enabling the next generation of IC manufacturing.

In January 2006, Nikon shipped the world’s first hyper-NA immersion lithography system—the NSR-S609B.  This was followed by the NSR-S610C, the industry’s first 1.30 NA immersion scanner for 45 nm half-pitch production, in February 2007. Later that year, Nikon introduced the cost-effective NSR-S310F and NSR-S210D scanners. These “dry” lithography systems adopted the same platform as the NSR-S610C, using the Tandem Stage to provide superior performance with excellent cost of ownership.

In 2009, Nikon began shipping the NSR-S620 ultra-high productivity immersion scanner. Nikon developed the S620D (NA = 1.35), based on the new Streamlign platform, to not just satisfy the aggressive performance requirements for double patterning lithography at 32 nm, but to also be extendible to 22 nm applications and beyond. The S620D Bird’s Eye Control system provides overlay capabilities down to 2 nm enabling the superior yield required for advanced processes. Stream Alignment reduces wafer overhead time and supports throughput up to 200 wafers per hour thereby enabling excellent productivity. In addition, the S620D Modular² Structure shortens installation time to enable rapid production ramps, and provides multigenerational platform capabilities to ensure maximum profitability for chip manufacturers. Most recently, Nikon announced the NSR-S320F, the latest evolution of the Streamlign platform to deliver exceptional performance and productivity for the most critical dry ArF applications.

Nikon is also fully engaged in EUV technology, with the Nikon EUV1 system already being used by multiple customers for early process development. EUV High Volume Manufacturing system availability will align with IC manufacturers’ requirements and the necessary infrastructure support.