Nikon Engineering Co. Ltd. continues to expand the MEMS Stepper product line to satisfy the unique photolithography requirements of Air Bearing Surface (ABS) fabrication for magnetic heads, Micro Electro Mechanical Systems (MEMS) and Light Emitting Diodes (LED). These steppers are also used in back-end processing, as well as optoelectronics, discrete semiconductors and crystal oscillator manufacturing. These specialized Nikon lithography solutions deliver maximum stepper yield at the lowest possible cost.
Although MEMS do not have the same aggressive requirements for imaging or overlay capabilities that are demanded by semiconductors, they necessitate that the lithography systems are able to handle extremely warped wafers and very thick films, and accommodate significant step heights with reasonable overlay accuracy. In addition, bulk MEMS applications or Taiko wafers often need precise alignment to marks located on the backside of the wafer surface. Nikon MEMS Steppers fully satisfy the critical requirements of these dynamic markets, and well over 160 systems are in use by customers around the world today.
Nikon offers a variety of MEMS Steppers using h-line illumination coupled with low lens numerical apertures specially optimized for MEMS-type applications and die-to-die autofocus, which enables these steppers to deliver the necessary resolution performance with tremendous depth of focus. Advanced systems that accommodate ghi and i-line resist processes, which are becoming increasingly prevalent in MEMS manufacturing, are also now available. Proven stepper technology ensures optimal CD uniformity across the wafer and projection lens designs eliminates costly mask contamination/ defectively issues experienced with contact or proximity printing methods. In addition, all Nikon MEMS Steppers utilize Enhanced Global Alignment (EGA) that has long been employed on traditional Nikon Step and Repeat Systems to provide optimal overlay accuracy. They also provide Pattern Matching Alignment capabilities that enable alignment to structures other than specific alignment marks. These critical functions are delivered on user-friendly, high productivity stepper platforms, with dramatically reduced system footprints to minimize equipment cost and cleanroom floor space usage.
Nikon continues to focus on expanding system capabilities and reducing cost to customers. Newly developed MEMS Steppers enable field sizes up to 44 x 44 mm, support wafer sizes up to 200 mm, provide enhanced imaging, and maximize productivity. Additionally, a multitude of add-on functions further boost MEMS Stepper performance and yield.
NES1W-h04 • NES1W-h04A
Solutions delivering resolution below 2.0 µm with enhanced overlay capabilities for substrates up to 200mm.
NES1W-ghi06 • NES2W-ghi06
Deliver ghi-line capabilities with resolution ≤ 2.5 µm. Targeted for MEMS, IC backend layers, and power device applications.
NES1W-i06 • NES2W-i06
Deliver i-line capabilities with resolution ≤ 2.0 µm for discrete, power, and analog device processing.
Delivers tremendous depth of focus and 44 mm² field size