DSP-100

Excellent back-end process lithography system for advanced packaging applications

With the widespread adoption of high-speed communication technologies such as the internet of things (IoT) and generative artificial intelligence (AI), the volume of information processing is rapidly increasing, driving demand for high-performance semiconductor devices, especially in data centers. In addition, as advanced packaging technologies such as chiplets—that connect multiple chips side by side—continue to progress, circuit patterns are becoming increasingly fine, and package sizes are growing. In response to these challenges, demand for panel-level packaging (PLP) using resin or glass substrates is expected to see continued growth.

The Digital Lithography System DSP-100 system is specifically developed for advanced packaging applications, supporting large substrates up to 600mm square and delivering high resolution of 1.0μm *¹ (L/S*²).

Combining High Resolution and Productivity

The DSP-100 integrates Nikon’s high-resolution semiconductor lithography technology with the multi-lens technology*3 from its flat panel display (FPD) lithography systems. It delivers high resolution (1.0μm L/S), excellent overlay accuracy (≦±0.3μm), and high productivity—up to 50 panels per hour using 510×515mm substrates.

Maskless Operation for Large Advanced Packaging Applications

Unlike conventional lithography systems that require photomasks with circuit patterns, the DSP-100 uses a spatial light modulator (SLM) to directly project circuit patterns onto substrates without the need for a photomask. This approach eliminates the size constraints of photomasks, provides greater flexibility for large, advanced packaging applications, and streamlines the development process—reducing both cost and lead time for customers.

Support for Large Square Substrates—9x Productivity Compared to Wafers

The DSP-100 supports exposure on large square substrates up to 600×600mm. For 100mm-square large packages, productivity per substrate is nine times higher than when utilizing 300mm wafers. Additionally, the system offers high-precision correction for substrate warpage and deformation, reducing production costs with maskless technology and minimizing maintenance costs with solid state light sources, supporting greener manufacturing. The information contained in this press release is current as of its date of publication.

*1 1 micrometer (μm) is one-millionth of a meter (one-thousandth of a millimeter).