Advanced Packaging Digital Lithography Systems

Nikon’s first ever packaging system is engineered to meet the evolving demands of advanced semiconductor packaging. Designed for large-substrate processing and high-resolution patterning, these solutions support next-generation chiplet integrations and heterogenous packaging applications with precision and scalability.

The DSP-100 system offers high-precision correction for substrate warpage and deformation, reducing production costs with maskless technology and minimizing maintenance costs with solid state light sources, supporting greener manufacturing.