NSR-S215D 

As semiconductor demand continues to evolve with the growth of IoT and AI, device manufacturers are under increasing pressure to deliver higher performance while maintaining cost efficiency—particularly at mature nodes.

The NSRS215D KrF Scanner was developed to address these challenges. Designed to support diverse device applications—from logic to memory and image sensors—it delivers reliable overlay performance, high throughput, and compatibility with existing Nikon KrF environments.

Key Benefits

1. Supports a wide range of manufacturing needs

The NSRS215D is built to accommodate diverse device requirements and production environments, making it an ideal solution for mature-node manufacturing.

• Supports both 300 mm and 200 mm wafers (optional configuration)
• Capable of handling warped wafers. Can handle 12-inch wafers up to ±300 μm and 8-inch wafers up to ±150 μm.
• Enables automated recipe creation
• Suitable for logic, memory, and image sensor applications

2. Seamless compatibility with existing Nikon KrF systems

Designed for easy integration, the NSRS215D allows customers to leverage current investments and streamline operations.

• Compatible with existing Nikon photomasks and exposure recipes
• Can supplement or replace legacy stepper systems
• Minimizes disruption to existing fab workflows

3. Designed for long-term operational support

The NSRS215D incorporates a system design focused on durability, maintainability, and long-term value.

• Enhanced maintainability at the component level
• Built for long lifecycle operation
• Backed by Nikon’s commitment to continuous customer support
• Designed to serve as a reliable long-term production partner

4. High productivity with optimal cost of ownership

Efficiency is critical for non-critical layer processing. The NSRS215D is engineered to maximize throughput while maintaining cost effectiveness.

• Achieves throughput ≥ 330 wafers per hour (WPH) (200 mm, optional configuration)
• Optimized scan speed and acceleration reduce exposure time
• Supports cost-efficient manufacturing for mature-node processes
• Delivers strong performance-to-cost ratio

Product Features

Flexible Wafer Handling

Supports both 200 mm and 300 mm wafer production, enabling fabs to adapt to varying manufacturing demands.

Advanced Wafer Stage Performance

Optimized scanning and acceleration technologies improve exposure efficiency and productivity.

Process Versatility

Handles a wide range of applications and wafer conditions, including warped substrates, to ensure stable production.

Fab Integration Efficiency

Compatibility with existing Nikon systems reduces ramp-up time and simplifies tool adoption.