Excellent i-line lithography solution for many device applications
As electric vehicles, high-speed communications and various IT devices become more pervasive, demand for the semiconductors that support them continues to grow. These semiconductors must perform a variety of challenging functions, and as result, device makers require specialized substrates and exposure systems to manufacture those chips. To address these challenges and requirements, Nikon has recently announced the NSR-2205iL1 5x reduction i-line stepper, which was developed to manufacture a variety of devices including power and communications semiconductors, and Micro Electro Mechanical Systems (MEMS).
The NSR-2205iL1 was developed in direct response to customer demand for these lithography systems that continue to play an essential role in chip manufacturing, and this novel i-line exposure system builds upon decades of Nikon stepper innovations and expertise to deliver excellent affordability and productivity for semiconductor devices, regardless of the wafer substrate material.
Readily integrated with existing fab equipment and operations
In order to streamline fab operations as well as optimize manufacturing flexibility and affordability for device makers, the NSR-2205iL1 was designed to be readily integrated with existing fab equipment and operations. Customers already having Nikon i-line exposure systems can utilize their current photomasks and wafer exposure recipes, and the NSR-2205iL1 can supplement or replace existing steppers that no longer meet manufacturing requirements.
High-productivity and cost-effective i-line stepper
This NSR-2205iL1 leverages well-established Nikon technologies to deliver high stepper productivity with maximized yield across varying manufacturing processes. This includes high-accuracy wafer measurement using multipoint autofocus (AF), advanced wafer stage leveling, and a large depth of focus (DOF) to maximize process window, among other central benefits.
The 2205iL1 also accommodates a multitude of applications through compatibility with different wafer sizes and thicknesses, has high wafer warpage tolerance, and supports customers’ varied production applications including SiC (silicon carbide) and GaN (gallium nitride) processes.
Sustainable solution for current and future manufacturing
The 2250i1L1 was also developed with a focus on sustainability and future maintenance, and many previously custom-type components were transitioned to general-purpose commercially available ones to reduce supply chain challenges.
Nikon continues to expand its lithography equipment portfolio, and the NSR-2205iL1 builds upon vast Nikon stepper experience to deliver a flexible, cost-effective, and sustainable solution to fully satisfy customers’ current and long-term i-line processing objectives.
|Exposure Area (mm)||22 x 22|
|Resolution (nm)||≤ 350¹|
|Single Machine Overlay (nm)||≤ 70¹|