Nikon Precision | USA & Europe | Nikon Global Site

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Carrie Gann
Advanced solution for critical layers, and supports 3D semiconductor device production Tokyo, Japan – December 6, 2023 – Nikon Corporation (Nikon) is pleased to announce the release of the NSR-S636E ArF immersion scanner, with system sales launching in January 2024. With the highest productivity of any lithography system across the impressive history of Nikon, the NSR-S636E...
Supports a variety of semiconductor devices and integrates well with existing fab equipment and operations Tokyo, Japan – August 31, 2023 – Nikon Corporation is pleased to announce the release of the NSR-2205iL1 5x reduction i-line stepper, which was developed to manufacture a variety of devices including power and communications semiconductors, and Micro Electro Mechanical Systems...
Enables batch inspection and measurement across entire 300 mm wafer area Tokyo, Japan – October 21, 2021 – Nikon Corporation (President: Toshikazu Umatate, Minato-ku, Tokyo) is pleased to announce the upcoming release of the AMI-5700 automatic macro inspection system, which performs batch inspection of 300 mm wafers with exceptional sensitivity and maximized productivity. Nikon automatic...
Tokyo, Japan – October 18, 2021 – Nikon Corporation (Nikon) announced it is currently developing the next-generation NSR-S636E ArF immersion scanner, which will deliver superior overlay accuracy and ultra-high throughput to support manufacturing of the most critical semiconductor devices. Product sales are scheduled to begin in 2023. As the digital transformation (DX) accelerates, there is...