Nikon Precision | USA & Europe | Nikon Global Site

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Carrie Gann
Tokyo, Japan – October 22, 2024 – Nikon Corporation (Nikon) is developing a digital lithography system with resolution of one micron (L/S) and high productivity for advanced semiconductor packaging applications. This product is scheduled to be released in Nikon’s fiscal year 2026.
Nikon Corporation is one of only 29 Distinguished Award recipients across Intel’s global supply chain. Tokyo, Japan – March 28, 2024 – Nikon Corporation (Nikon) is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, Nikon Corporation has achieved a level...
Advanced solution for critical layers, and supports 3D semiconductor device production Tokyo, Japan – December 6, 2023 – Nikon Corporation (Nikon) is pleased to announce the release of the NSR-S636E ArF immersion scanner, with system sales launching in January 2024. With the highest productivity of any lithography system across the impressive history of Nikon, the NSR-S636E...
Supports a variety of semiconductor devices and integrates well with existing fab equipment and operations Tokyo, Japan – August 31, 2023 – Nikon Corporation is pleased to announce the release of the NSR-2205iL1 5x reduction i-line stepper, which was developed to manufacture a variety of devices including power and communications semiconductors, and Micro Electro Mechanical Systems...
Enables batch inspection and measurement across entire 300 mm wafer area Tokyo, Japan – October 21, 2021 – Nikon Corporation (President: Toshikazu Umatate, Minato-ku, Tokyo) is pleased to announce the upcoming release of the AMI-5700 automatic macro inspection system, which performs batch inspection of 300 mm wafers with exceptional sensitivity and maximized productivity. Nikon automatic...
Tokyo, Japan – October 18, 2021 – Nikon Corporation (Nikon) announced it is currently developing the next-generation NSR-S636E ArF immersion scanner, which will deliver superior overlay accuracy and ultra-high throughput to support manufacturing of the most critical semiconductor devices. Product sales are scheduled to begin in 2023. As the digital transformation (DX) accelerates, there is...